How Does Vacuum Technology Impact FPCB Cover Film Adhesion Quality?

Vigor's 150Ton Vacuum Quick Press achieves 20 torr vacuum in just 3 seconds, eliminating air pockets between layers that cause delamination and reliability issues. This rapid vacuum capability combined with uniform temperature distribution (up to 190°C) ensures perfect adhesion of cover films to flexible circuit boards, reducing defect rates by up to 40% compared to conventional presses. Contact us to learn how this technology can improve your FPCB yield rates.

Engineered specifically for multi-layer flexible board applications, this robust lamination press features exceptional temperature uniformity up to 190°C across the entire heating platen. The system's user-friendly design simplifies operation while maximizing production efficiency and extending sub-material service life. With its substantial 150-ton capacity and precision-engineered components, the VFPC3-15V significantly reduces transfer printing requirements while maintaining consistent quality across high-volume production runs. Backed by Vigor Machinery's reputation for reliability and performance, this vacuum quick press delivers the competitive edge needed in today's demanding electronics manufacturing environment.